【簡介】 【目錄】 Experts must be able to analyze and distinguish all materials, or combinations of materials, in use today―whether they be metals, ceramics, polymers, semiconductors, or composites. To understand a material’s structure, how that structure determines its properties, and how that material will subsequently work in technological applications, researchers apply basic principles of chemistry, physics, and biology to address its scientific fundamentals, as well as how it is processed and engineered for use. Emphasizing practical applications and real-world case studies, Materials Characterization Techniques presents the principles of widely used, advanced surface and structural characterization techniques for quality assurance, contamination control, and process improvement. This useful volume: Explores scientific processes to characterize materials using modern technologies Provides analysis of materials’ performance under specific use conditions Focuses on the interrelationships and interdependence between processing, structure, properties, and performance Details the sophisticated instruments involved in an interdisciplinary approach to understanding the wide range of mutually interacting processes, mechanisms, and materials Covers electron, X-ray-photoelectron, and UV spectroscopy; scanning-electron, atomic-force, transmission-electron, and laser-confocal-scanning-florescent microscopy, and gel electrophoresis chromatography Presents the fundamentals of vacuum, as well as X-ray diffraction principles Explaining appropriate uses and related technical requirements for characterization techniques, the authors omit lengthy and often intimidating derivations and formulations. Instead, they emphasize useful basic principles and applications of modern technologies used to characterize engineering materials, helping readers grasp micro- and nanoscale properties. This text will serve as a valuable guide for scientists and engineers involved in characterization and also as a powerful introduction to the field for advanced undergraduate and graduate students.
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Fundamentals of Powder Diffraction and Structural Characterization of Materials provides an in-depth introduction to the theories and applications of the powder diffraction method for structure determination. The emphasis is placed on powder diffraction data collected using conventional x-ray sources, which remain primary tools for thousands of researchers and students in their daily experimental work. The book is divided into two chapters one though three give essential theoretical background, while chapters four through seven guide the reader through practical aspects of extracting structural information from powder data. The book is supplemented by a compact disk containing experimental data collected from a variety of materials that are used as examples and in the problems offered at the end of every chapter. In addition color electronic versions of some 300 illustrations found throughout the book will be included.
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FROM LED TO SOLID STATE LIGHTING A comprehensive and practical reference complete with hands-on exercises and experimental data In From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications, accomplished mechanical engineers Shi-Wei Ricky Lee, Jeffery C. C. Lo, Mian Tao, and Huaiyu Ye deliver a practical overview of the design and construction of LED lighting modules, from the fabrication of the LED chip to the LED modules incorporated in complete LED lighting fixtures. The distinguished authors discuss the major advantages of solid-state lighting, including energy savings, environmental friendliness, and lengthy operational life, as well as the contributions offered by the packaging of light-emitting diodes in the pursuit of these features. Readers will discover presentations of the technical issues that arise in packaging LED components, like interconnection, phosphor deposition, and encapsulation. They’ll also find insightful elaborations on optical design, analysis, and characterization. Discussions of LED applications, technology roadmaps, and IP issues round out the included material. This important book also includes: Thorough introductions to lighting, photometry, and colorimetry, the fundamentals of light-emitting diodes, and the fabrication of LED wafers and chips Practical discussions of the packaging of LED chips, wafer-level packaging of LED arrays, and optical and electrical characterization Comprehensive explorations of board-level assembly and LED modules and optical and electrical characterization In-depth examinations of thermal management, reliability engineering for LED packaging, and applications for general lighting Perfect for post-graduate students and practicing engineers studying or working in the field of LED manufacturing for solid state lighting applications, From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, and Applications is also an indispensable resource for managers and technicians seeking a one-stop guide to the subject.
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