Quantum Heterostructures Microelectronics and Optoelectronics (1版)

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Quantum Heterostructures provides a detailed description of the key physical and engineering principles of quantum semiconductor heterostructures. Blending important concepts from physics, materials science, and electrical engineering, it also explains clearly the behavior and operating features of modern microelectronic and optoelectronic devices. The authors begin by outlining the trends that have driven development in this field, most importantly the need for high-performance devices in computer, information, and communications technologies. They then describe the basics of quantum nanoelectronics, including various transport mechanisms. In the latter part of the book, they cover novel microelectronic devices, and optical devices based on quantum heterostructures. The book contains many homework problems and is suitable as a textbook for undergraduate and graduate courses in electrical engineering, physics, or materials science. It will also be of great interest to those involved in research or development in microelectronic or optoelectronic devices.

PLASTIC BENDING THEORY AND APPLICATIONS

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From the point of view of mechanics, this monograph systematically demonstrates the theory of plastic bending and its engineering applications; most of the contents of the book are based on the authors' research in the past decade. The monograph not only expounds the contributions of the authors to the fundamental theory of plastic bending, but also presents various applications of the theory in sheet metal forming, particularly in the analysis and prediction of springback and wrinkling of strips and plates subjected to bending or stamping. In addition to theoretical modelling, attention has also been paid to the development of related numerical methods; comparisons with experimental results are also presented.

機械材料 (2版)

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【簡介】 【目錄】 1. Stress 2. Strain 3. Mechanical Properties of Materials 4. Axial Load 5. Torsion 6. Bending 7. Transverse Shear 8. Combined Loadings 9. Stress Transformation 10. Strain Transformation 11. Design of Beams and Shafts 12. Deflection of Beams and Shafts 13. Buckling of Columns 14. Energy Methods APPENDICES

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書名：Frontier Research in Computation and Mechanics of Materials and Biology: Volume 4 作者：Quan Gu 出版商：World Scientific 出版日期：2023-09-01 ISBN：9789811209147 內容簡介 DESCRIPTION The unique compendium teaches beginners how to perform nonlinear finite element (FE) analysis by following a series of step-by-step examples and basic programming method using OpenSees. The scope of the book includes nonlinear FE analyses of reinforced concrete frame shear wall structures, liquefiable soils, soil-structure interaction systems, fluid-solid coupling systems, high-speed railway systems, as well as introduces the sensitivity, reliability, optimization, peridynamic (PD) analysis, and the integration of OpenSees with other softwares. This must-have reference also teaches users how to program by adding simple material and element models, as well as PD algorithms in OpenSees. Sample Chapter(s) Preface Chapter 2: A Simple Structural Analysis Example Chapter 16: Adding an Elasto-Perfect-Plasticity Material in OpenSees Contents: Introduction to OpenSees Application: Download and Run A Simple Structural Analysis Example Introduction to Tcl Syntax Frame Structure Analyses Analyses for Reinforced Concrete Shear Walls Soil–Structure Interaction (SSI) System Fluid–Solid Coupling Numerical Analyses of Soil Liquefaction Numerical Optimization Coupling OpenSees with Other Software Using the Client–Server Technique Response Sensitivity Analysis Based on Direct Differentiation Method (DDM) Structural Analysis Based on Bond-Based Peridynamics (BPD) A Wheel–Rail Interaction Element for High-Speed Railway System Reliability Analysis Introduction to OpenSees Programming: Downloading the Package and Building OpenSees Source Code Adding an Elasto-Perfect-Plasticity Material in OpenSees Adding a New Element in OpenSees Implementing State-Based Peridynamics (SPD) in OpenSees Readership: Professionals, academics, researchers and graduate students in civil engineering, earthquake engineering and engineering mechanics.