Chemistry in Microelectronics

Chemistry in Microelectronics Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in "Front End Of the Line" which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications.

Preface ix Chapter 1. Chemistry in the "Front End of the Line" (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts 1 François MARTIN, Jean-Michel HARTMANN, Véronique CARRON and Yannick LE TIEC 1.1. Introduction 1 1.2. Arrangement of the gate 3 1.3. Chemistry of crystalline materials 19 1.4. Contact areas between the gate and the "source" and "drain" 38 1.5. General conclusion 57 1.6. List of Abbreviations 58 1.7. Bibliography 59 Chapter 2. Chemistry in Interconnects 81 Vincent JOUSSEAUME, Paul-Henri HAUMESSER, Carole PERNEL, Jeffery BUTTERBAUGH, Sylvain MAÎTREJEAN and Didier LOUIS 2.1. Introduction 81 2.2. Interconnects: generalities and background 83 2.3. Dielectric deposits 99 2.4. Deposition and properties of metal layers for interconnect structures 122 2.5. Cleaning process for copper interconnects 144 2.6. General conclusions and perspectives 161 2.7. List of Abbreviations 164 2.8. Bibliography 165 Chapter 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying 187 Yannick LE TIEC and Martin KNOTTER 3.1. Introduction 187 3.2. Cleaning 188 3.3. Wet etching 202 3.4. Rinsing and drying 214 3.5. Conclusion 224 3.6. List of Abbreviations 225 3.7. Bibliography 225 Chapter 4. The Use and Management of Chemical Fluids in Microelectronics 233 Christiane GOTTSCHALK, Kevin MCLAUGHLIN, Julie CREN, Catherine PEYNE and Patrick VALENTI 4.1. Ultrapure water 233 4.2. Gases for semiconductors 251 4.3. Dissolved gases 268 4.4. High-purity chemicals 283 4.5. Waste management 290 4.6. List of Abbreviations 301 4.7. Bibliography 303 Chapter 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors 309 Antoine HOANG, Gilles MARCHAND, Guillaume NONGLATON, Isabelle TEXIER-NOGUES and Francoise VINET 5.1. Introduction 309 5.2. Materials 310 5.3. Functionalization process 317 5.4. Molecule and macromolecule immobilization 332 5.5. Analytes capture 340 5.6. Conclusion 348 5.7. List of Abbreviations 349 5.8. Bibliography 349 List of Authors 361 Index 363