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書名：Integrated Circuit Test Engineering: Modern Techniques 作者：GROUT 出版社：Springer 出版日期：2005/12/30 ISBN：9781846280238
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Integrated Circuit Test Engineering: Modern Techniques 2006
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詳細資訊
書名：Integrated Circuit Test Engineering: Modern Techniques 作者：GROUT 出版社：Springer 出版日期：2005/12/30 ISBN：9781846280238
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【簡介】 Master fundamental technologies for modern semiconductor integrated circuits with this definitive textbook. It includes an early introduction of a state-of-the-art CMOS process flow, exposes students to big-picture thinking from the outset, and encourages a practical integration mindset. Extensive use of process and TCAD simulation, using industry tools such as Silvaco Athena and Victory Process, provides students with deeper insight into physical principles, and prepares them for applying these tools in a real-world setting. Accessible framing assumes only a basic background in chemistry, physics and mathematics, providing a gentle introduction for students from a wide range of backgrounds; and over 450 figures (many in color), and more than 280 end-of-chapter problems, will support and cement student understanding. Accompanied by lecture slides and solutions for instructors, this is the ideal introduction to semiconductor technology for senior undergraduate and graduate students in electrical engineering, materials science and physics, and for semiconductor engineering professionals seeking an authoritative introductory reference. 【目錄】 Frontmatter 1 - Historical Perspective, Moore’s Law and Future Technology Prospects pp 1-36 2 - Modern Complementary Metal-Oxide–Semiconductor (CMOS) Technology pp 37-69 3 - Semiconductor Materials: Crystal Growth, Wafer Preparation and Material Properties pp 70-110 4 - Semiconductor Manufacturing: Cleanrooms, Wafer Cleaning, Gettering and Chip Yield pp 111-158 5 - Lithography pp 159-254 6 - Semiconductor/Insulator Interfaces pp 255-309 7 - Doping in Semiconductors pp 310-379 8 - Ion Implantation pp 380-447 9 - Etching Technologies and Chemical–Mechanical Polishing pp 448-502 10 - Deposition Technologies pp 503-550 11 - Back-End (Interconnect) Processing Technologies pp 551-618 Appendices pp 619-656 A.1 - Basics of Semiconductor Materials in Equilibrium pp 619-640 A.2 - Standard Prefixes pp 641-641 A.3 - Useful Conversions pp 642-642 A.4 - Physical Constants pp 643-643 A.5 - Physical Properties of Silicon pp 644-644 A.6 - Properties of Insulators Used in Semiconductor Technology pp 645-645 A.7 - Color Chart for Thermally Grown SiO2 Films Observed Perpendicularly under Daylight Fluorescent Lighting pp 646-646 A.8 - Irvin Curves pp 647-648 A.9 - Error Function pp 649-652 A.10 - List of Important Symbols pp 653-653 A.11 - List of Common Acronyms pp 654-656 Index pp 657-662
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