| 書名: | Solder Joint Technology Materials, Properties, and Reliability | |||
| 作者: | K.N.TU | |||
| ISBN: | 9780387388908 | |||
| 出版社: | Springer | |||
| 出版日期: | 2007/01 | |||
| 書籍開數、尺寸: | 23.4x16.5x2.3 | |||
| 頁數: | 368 | |||
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#工程
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| 定價: | ||||
| 售價: | 1700元 | |||
| 庫存: | 有庫存: >=5 | |||
| LINE US! | 詢問這本書 團購優惠、書籍資訊 等 | |||
Solder Joint Technology Materials, Properties, and Reliability
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詳細資訊
The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
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