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ENTIRE AND MEROMORPHIC FUNCTIONS 1996
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Table of Content Chapter 1. Introduction to the System-on-Package (SOP) Technology Chapter 2. Introduction to System-on-Chip (SOC) Chapter 3. Stacked ICs and Packages (SIP) Chapter 4. Mixed-Signal (SOP) Design Chapter 5. Radio Frequency System-on-Package (RF SOP) Chapter 6. Integrated Chip-to-Chip Optoelectronic SOP Chapter 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components Chapter 8. Mixed-Signal Reliability Chapter 9. MEMS Packaging Chapter 10. Wafer-Level SOP Chapter 11. Thermal SOP Chapter 12. Electrical Test of SOP Modules and Systems Chapter 13. Biosensor SOP Index
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