工程電磁學 (Fundamentals of Engineering Electromagnetics) (1版)

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【中文翻譯書】 書名：工程電磁學 第一版 原文書名：Fundamentals of Engineering Electromagnetics 作者：David K. Cheng 翻譯：游信勝 出版社：偉明 出版日期：1998/01/01 ISBN：9789579899116 目錄 第一章 電磁模型 第二章 向量分析 第三章 靜電場 第四章 穩定電流 第五章 靜磁場 第六章 時變場和馬克斯威爾方程式 第七章 平面電磁波 第八章 傳輸線 第九章 波導管和空腔共振器 第十章 天線和天線陣列 附錄A 符號和單位 附錄B 一些有用的物質常數

ANALYSIS METHODS FOR RF, MICROWAVE,AND MILLIMETER-WAVE

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DESCRIPTION A one-stop reference to the major techniques for analyzing microwave planar transmission line structures The last two decades have seen important progress in the development of methods for the analysis of microwave and millimeter-wave passive structures, which contributed greatly to microwave integrated circuit design while also stimulating the development of new planar transmission lines. This timely and authoritative work introduces microwave engineers to the most commonly used techniques for analyzing microwave planar transmission line structures. Designed to be easily accessible to readers with only a fundamental background in electromagnetic theory, the book provides clear explanations of the theory and applications of Green's function, the conformal-mapping method, spectral domain methods, variational methods, and the mode-matching methods. Coverage for each method is self-contained and supplemented with problems and solutions as well as useful figures. In addition to providing detailed formulations of the methods under discussion, this highly practical book also demonstrates how to apply the principles of electromagnetic theory to the analysis of microwave boundary value problems, customize methods for specific needs, and develop new techniques. Analysis Methods for RF, Microwave, and Millimeter-Wave Planar Transmission Line Structures is an excellent working resource for anyone involved in the design and engineering of RF, microwave, and millimeter-wave integrated circuits.

MICROVIAS FOR LOW COST,HIGH DENSITY INTERCONNECTS (1版)

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System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.