【簡介】 The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries. 【目錄】 Preface vii Preface to the Fourth Edition ix Contributors xi Conversion Factors xiii Graphical Conversions xv The Electrochemical Society Series xvii 1 Fundamental Considerations 1 Milan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder 2 Electrodeposition of Copper 33 Jack W. Dini and Dexter D. Snyder 3 Electrodeposition of Nickel 79 George A. Di Bari 4 Electrodeposition of Gold 115 Paul A. Kohl 5 Electroless and Electrodeposition of Silver 131 Mordechay Schlesinger 6 Tin and Tin Alloys for Lead-Free Solder 139 Yun Zhang 7 Electrodeposition of Chromium 205 Nenad V. Mandich and Donald L. Snyder 8 Electrodeposition of Lead and Lead Alloys 249 Manfred Jordan 9 Electrodeposition of Tin–Lead Alloys 265 Manfred Jordan 10 Electrodeposition of Zinc and Zinc Alloys 285 René Winand 11 Electrodeposition of Iron and Iron Alloys 309 Masanobu Izaki 12 Palladium Electroplating 327 Joseph A. Abys 13 Electrochemical Deposition Process for ULSI Interconnection Devices 369 Tetsuya Osaka and Masahiro Yoshino 14 Electrodeposition of Semiconductors 383 T. E. Schlesinger, Krishnan Rajeshwar, and Norma R. De Tacconi 15 Deposition on Nonconductors 413 Mordechay Schlesinger 16 Conductive Polymers: Electroplating of Organic Films 421 Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma 17 Electroless Deposition of Copper 433 Milan Paunovic 18 Electroless Deposition of Nickel 447 Mordechay Schlesinger 19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems 459 Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka 20 Electroless Deposition of Palladium and Platinum 477 Izumi Ohno 21 Electroless Deposition of Gold 483 Yutaka Okinaka and Masaru Kato 22 Electroless Deposition of Alloys 499 Izumi Ohno 23 Preparation for Deposition 507 Dexter D. Snyder 24 Manufacturing Tools 513 Tom Ritzdorf 25 Monitoring and Control 527 Tom Ritzdorf 26 Environmental Aspects of Electrodeposition 555 Micha Tomkiewicz 27 Applications to Magnetic Recording and Microelectronic Technologies 573 Stanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov 28 Microelectromechanical Systems 617 Giovanni Zangari 29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques 637 Xianying Meng-Burany 30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates 665 Robert Petro, Mordechay Schlesinger, and Guang-Ling Song Appendix 687 Index 701