微電子系統封裝基礎理論與應用技術 (1版)

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微電子系統封裝基礎理論與應用技術 + 作者： 江國寧著 + 年份： 2006 年1 版 + ISBN： 9867287657 + 書號： EE0301 + 規格： 16開/平裝/單色 + 頁數： 248 + 出版商： 滄海 封裝技術在半導體、光電與微機電相關產業上扮演著關鍵性的角色。本書以較深入與實用的角度介紹封裝技術的製程、電訊、材料、機械及力學可靠度行為，讀者應能藉由本書的基礎理論及應用內容而對封裝技術有更深一層的了解。本書內容難易適中，適合做為大專院校之教科書，亦適合為半導體與封裝相關產業工程人員的參考書籍。 第1章 簡介 第2章 封裝系統電性設計概論 第3章 I/O接合技術 第4章 熱傳與應力分析基礎理論 第5章 濕度效應 第6章 金屬界層之擴散成長 第7章 錫鉛凸塊熔融外形預估方法 第8章 微應力感測元件基礎理論 第9章 晶圓級封裝之結構參數化設計與可靠度改良分析 附錄 常用半導體與封裝術語

Quantum Heterostructures Microelectronics and Optoelectronics (1版)

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Quantum Heterostructures provides a detailed description of the key physical and engineering principles of quantum semiconductor heterostructures. Blending important concepts from physics, materials science, and electrical engineering, it also explains clearly the behavior and operating features of modern microelectronic and optoelectronic devices. The authors begin by outlining the trends that have driven development in this field, most importantly the need for high-performance devices in computer, information, and communications technologies. They then describe the basics of quantum nanoelectronics, including various transport mechanisms. In the latter part of the book, they cover novel microelectronic devices, and optical devices based on quantum heterostructures. The book contains many homework problems and is suitable as a textbook for undergraduate and graduate courses in electrical engineering, physics, or materials science. It will also be of great interest to those involved in research or development in microelectronic or optoelectronic devices.

PLASTIC BENDING THEORY AND APPLICATIONS

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From the point of view of mechanics, this monograph systematically demonstrates the theory of plastic bending and its engineering applications; most of the contents of the book are based on the authors' research in the past decade. The monograph not only expounds the contributions of the authors to the fundamental theory of plastic bending, but also presents various applications of the theory in sheet metal forming, particularly in the analysis and prediction of springback and wrinkling of strips and plates subjected to bending or stamping. In addition to theoretical modelling, attention has also been paid to the development of related numerical methods; comparisons with experimental results are also presented.

Electronic Packaging Science and Technology (1版)

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Electronic Packaging Science and Technology ISBN13：9781119418313 出版社：WILEY 作者：Chih Chen 裝訂：精裝 出版日：2022/01/12