3D IC & RF SIPs: ADVANCED STACKING & PLANAR SOLUTIONS FOR 5G MOBILITY

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書名：3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5G Mobility 作者：HWANG 出版社：WILEY 出版日期：2018/06/00 ISBN：9781119289647

American Empower C1 Advanced Student's Book with Digital Pack (1版)

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【簡介】 ■學生課本附線上帳號(拆封不退) ■CEFR Level: C1 ■適用程度: Advanced ■線上學習資源含課程音檔、課程影片、額外聽說讀寫及文法字彙練習 ■線上電子書平台網址：cambridgeone.org   ★購買提示 學生課本不含解答，如需解答者請購買教師手冊(9781108798037) 課堂使用或自修者建議搭配購買作業本(9781108817356) The Advanced Student's Book with Digital Pack provides clear learning objectives, core grammar and vocabulary input alongside a mix of skills. Speaking lessons offer a unique combination of functional language, pronunciation and conversation skills. Each unit ends with a consolidation of core language from the unit. This version of the Student's Book comes with access to a Digital Pack: Online Assessment, Digital Workbook, Class Audio, Documentary Video, Workbook Audio, and an eBook with audio, available on the Cambridge One platform.

American Empower C1 Advanced Workbook with Answers (1版)

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【簡介】 　　■作業本含解答   The Advanced Workbook with answers can be used alongside the Student's Book and offers additional consolidation activities. Downloadable audio is available on Cambridge One.