Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (1版)

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package ISBN13：9781119793779 出版社：WILEY 作者：Steffen Kröhnert(EDI) 裝訂：精裝 出版日：2022/02/15