EMBEDDED CONTROL FOR MOBILE ROBOTIC APPLICATIONS

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DESCRIPTION An all-in-one resource for designing and implementing embedded control in mobile robotics In Embedded Control for Mobile Robotic Applications, a distinguished trio of researchers delivers an authoritative and fulsome resource for understanding embedded control and robotics. The book includes coverage of a variety of embedded platforms, their use in controller implementation, stability analyses of designed controllers, and two new approaches for designing embedded controllers. The authors offer a full chapter on Field-Programmable-Gate-Array (FPGA) architecture development for controller design that is perfect for both practitioners and students taking robotics courses and provide a companion website that includes MATLAB codes for simulation and embedded platform-specific code for mobile robotic applications (in Embedded C and Verilog). The two approaches discussed by the authors—the top-down methodology and the bottom-up methodology—are of immediate practical utility to both practicing professionals in the field and students studying control applications and mobile robotics. The book also offers: A thorough introduction to embedded control, including processor, IC, and design technology, as well as a discussion of limitations in embedded control design Comprehensive explorations of the bottom-up and top-down methods, including computations using CORDIC, interval arithmetic, sliding surface design, and switched nonlinear systems Practical discussions of generic FPGA architecture design, including Verilog, PID controllers, DC motors and Encoder, and a systematic approach for designing architecture using FSMD In-depth examinations of discrete-time controller design, including the approximation to discrete-time transfer function and embedded implementation stability Perfect for practitioners working in embedded control design and control applications in robotics, Embedded Control for Mobile Robotic Applications will also earn a place in the libraries of academicians, researchers, senior undergraduate students, and graduate students in these fields.

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces (1版)

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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package ISBN13：9781119793779 出版社：WILEY 作者：Steffen Kröhnert(EDI) 裝訂：精裝 出版日：2022/02/15