3D IC Stacking Technology (1版)

【原文書】 書名：3D IC Stacking Technology 作者：B.WU 出版社：McGraw-Hill 出版日期：2011/07/28 ISBN：9780071741958 With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.