Semiconductor processes and integration (1版)

Semiconductor Processes and Integration is a comprehensive book that systematically covers semiconductor fabrication and integration technologies across multiple generations of transistor architectures, including MOSFETs, FinFETs, GAAFETs, and CFETs. This book's academic contribution lies in modernizing teaching materials and bridging the gap between industry and academia. This book contains 14 chapters. It begins with the fundamentals of semiconductor materials and physics, followed by detailed discussions of key unit processes such as oxidation, lithography, ion implantation, etching, CVD, metallization, and planarization. The text further explores advanced process integration for both 2D planar and 3D FinFET devices, incorporating modern innovations such as strained silicon channels, high-k gate dielectrics, and metal gate technologies. Additionally, it introduces essential material characterization techniques, including SEM, TEM, X-ray spectroscopy, and Raman spectroscopy, and extends to emerging trends such as GAAFETs, CFETs, and 3D IC heterogeneous integration. With comprehensive coverage of mass-production technologies developed since 2010, this book serves as an indispensable reference for students, professionals, researchers, and anyone working at the forefront of semiconductor technology.

1 Semiconductor Integrated Circuit Development 2 Basic Semiconductor Materials 3 Base Semiconductor Devices 4 Oxidation and Heating Processes 5 Lithography 6 Diffusion and Ion Implantation Process 7 Etching Process 8 Dielectric Films and Chemical Vapor Deposition 9 Metallization Process 10 CMOSFET Process Integration 11 Advanced Device Process 12 FinFET Process Integration 13 Semiconductor Materials Analysis Technology 14 GAAFET and CFET to 3D IC Heterogeneous Integration